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发布日期:2021年09月23日
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UMC's testing services incorporate the latest software and hardware solutions to provide efficient, streamlined testing. We have equipped in-house CP facilities that are near every UMC fab to provide comprehensive testing services. Customers can monitor test yield and WIP stages via the MyUMC online customer web portal.

Furthermore, UMC also offers verified package solutions, with an emphasis on solution development. With a robust low-K probing solution and advanced backend structures such as BOAC, UMC's development methodology is critical to ensure compatibility between silicon and package material.

Test Program Development & Services

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  • Testing Solution Development

    Excellent and Diverse Experience in Program Development

    Professional Hardware Design and Probe Card Making

    Work with Customers for Cost Effective Test Solution Development

  • Volume Production

    Quick Silicon Validation for Fast Yield Feedback

    Proactive Customized Test / Alert Report for Yield Monitor

    Production Yield Monitoring and Improvement by Bin Limit Control Mechanism

  • Customized Service

    Remote Access Tester to Expedite Validation

    Testing Sequence, Probing & Cleaning Recipe Optimization

    Product Characterization by Corner Wafers